At this stage, the micro-assembly and micro-package markets have shown a trend of rapid development, and new materials and new processes are constantly being introduced. New soft and hard brazing processes such as tin, gold germanium, tin silver copper and silver copper have been widely used.

The company's core technical team closely focuses on the application of the above advanced packaging materials to carry out technical research, and forward-lookingly proposes the concept of SOP system integrated packaging, taking the system as the design object, emphasizing the integration of circuit design and integrated manufacturing, and the compatibility of process materials with structure and circuit integration. SOP is compatible with SOC, MCM, SIP and other advanced packaging technologies. Through composite material application and efficient thermal management design, the specific requirements of high density, high power, miniaturization and low cost of chip packaging modules are realized, reflecting the integrated design and integration Manufacturing systems integration thinking.

Through years of technical accumulation and scientific and technological research, the company has correspondingly equipped with heat-adaptive mold design, structural reliability finite element analysis, microwave radio frequency simulation, brazing and sealing, surface coating, precision machining, HTCC high temperature ceramic technology, etc. Core design and process technology.