The package usually adopts metal ring frame high temperature brazing ceramic radio frequency feed component, metal heat dissipation plate structure. The shape, structure and size and number of RF feed pins can be customized. The supporting cover plate adopts the step cover structure to meet the parallel seam welding process. The illustrated sample shows the standard packaging structure of 2pin RF power transistor, and the sealing surface size is 16 ㎜ X16 ㎜, which can replace the inlet power tube seal equally.