Companies of this type of package provide thermal management, micro-assembly process adaptation, structural reliability design, LTCC, HTCC ceramic circuit substrate brazing thermal stress analysis and other services in the structure design stage. If necessary, users/customers can participate in the package structure scheme discussion or provide preliminary solutions during the project development stage. The supporting cover plate can be designed according to the actual sealing process of the user, which can meet the different sealing processes such as laser welding, electron beam welding and parallel seam welding. If necessary, it can provide targeted weight-saving design or the design of reinforcing cover plates .